Please note that JavaScript and style sheet are used in this website,
Due to unadaptability of the style sheet with the browser used in your computer, pages may not look as original.
Even in such a case, however, the contents can be used safely.
Japan
Trends in package development
| The semiconductor industry is under increasing pressure to downsize devices, leverage more advanced technology, and create multifunction devices. The industry has responded by developing new and improved packaging technologies including increasing the number of pins, downsizing, and raising density so that more semiconductor devices can be allocated within a specific area. Going forward, the demand for new packages with even greater sophistication will drive package innovation. |
|
© 1995-2009 NEC Electronics Corporation